First-level areas：Information Technology
First-level areas：Chips, Electronic Components and Equipment
Source：Social Recruitment
Job description ：
Job Responsibilities.
1. Plan the company’s product technology development route, organize the formulation and implementation of major product technology decisions and plans, and achieve the company’s product technology innovation;
2. Responsible for organizing and guiding the technical team to carry out new product development, technological innovation, and process improvement work under the overall architecture, coordinating various aspects of project development or implementation, and grasping the overall progress of the project;
4. Responsible for researching business technology solutions; Leading major decisions in version iteration, accurately translating business requirements into design requirements, and forming system architecture design;
5. Responsible for maintaining a keen perception of new technologies in the industry, actively exploring the application of new technologies in the company’s systems, and providing important suggestions for the company’s future technological direction;
6. Lead the technical team to accomplish various tasks such as architecture design, system analysis, product development, platform new feature development, and performance optimization of the technical system.
Job requirements.
1. Master’s degree or above, doctoral degree preferred, major in power electronics or semiconductor related fields;
2. More than 5 years of research and development experience in device or packaging related industries, with priority given to those with SIC/GaN device or packaging experience;
3. Strong product development capabilities and rich project management skills; Good English listening, speaking, reading, and writing skills;
4. Possess sharp and accurate insight and meticulous logical thinking, able to grasp industry business development trends and key technology development trends.

Please send your CV or resume as an attachment to the following email address:
mailto: rbhr@hrcenter.co.uk
With the subject line formatted as: ‘Name + Position + Company Name + Location’.